G09200 - SEMI G92 - Specification for Tape Frame Cassette for 450 mm Wafer Revision:SEMI G92-0315 - Superseded approaches suitable for use in

approaches suitable for use in smaller facilities are outlined in Related Information 1

2  This Standard specifies the application of the appropriate processing to specified material received at the processing agent

This Standard assumes that the GEM fundamental requirements and selected additional capabilities (as specified in § 13) have been implemented on the IBSEM equipment

This Standard covers specifications for services to and events from CLJ and CFJ models

G09200 - SEMI G92 - Specification for Tape Frame Cassette for 450 mm Wafer Revision:SEMI G92-0315 - Superseded approaches suitable for use inThe purpose of this Standard is to specify mechanical features for the 450 mm wafer tape frame cassette used between the wafer mounting process and the die bonding process. This Standard is intended to set an appropriate level of specification that places minimal limits on innovation while ensuring modularity and interchangeability at all mechanical interfaces. Only the mechanical interfaces for the tape frame cassette are specified. Materials kinds